US 11,597,808 B2 – Method For Preparing Modified Polypropylene Film

Researchers:   Daniel Qi TAN, Guanghui SONG,  Xudong WU

Categories: Film materials

Jurisdiction: United States, Japan (特许第7166317号) , China (ZL 2020109135669)

Current status:   Granted

Basic Information

The invention discloses a high-temperature-resistant modified polypropylene film, and a preparation method and application thereof. The modified polypropylene film comprises a polypropylene film and an oxide layer and/or a nitride layer on the surface of the polypropylene film; the thickness of the oxide layer or the nitride layer is 20-500nm. The thermal stability and high-temperature voltage resistance of the polypropylene film can be obviously improved by depositing an oxide layer or a nitride layer with proper thickness on the surface of the polypropylene film by using the ALD technology. The modified polypropylene film has high temperature resistance, such as 150 ℃, has extremely small deformation amount at high temperature, can bear high breakdown voltage at high temperature, such as 580kV/mm at 140 ℃, and has wide application in the field of electronic products with high temperature requirements, such as capacitors.

Innovation

1. The modified polypropylene film has high temperature resistance (for example, high temperature of more than 150 ℃), still has little deformation at high temperature, has good mechanical property, and can bear high breakdown voltage at high temperature (for example, the voltage which can be borne by the modified polypropylene film at 140 ℃) is 580kV/mm.
2. The modified polypropylene film prepared by the invention has wide application in the field of electronic products with high temperature requirements, such as the field of capacitors